Sn99Ag0.3Cu0.7 Solder Bar
1. Electrolytic pure tin, good wettability and fluidity, easy to tin.
2. The solder joints are bright and full, and there will be no defects such as cold solder joints.
3. Add sufficient antioxidant elements, strong antioxidant ability.
4. Less tin slag, reduce energy consumption and unnecessary waste.
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Product Description and Chemical Components
Applications
Specification
Sn99-Ag0.3-Cu0.7
Appearance
Lucent, no dirt on surface
Packing
G.W.: 500g/roll, 10kg/ctn.
Chemical Components
Sn
Ag
Cu
Pb
Sb
Bi
Zn
Fe
Al
As
Cd
Residue Content
0.3±0.1
0.7±0.2
< 0.1
< 0.1
< 0.06
< 0.001
< 0.02
< 0.001
< 0.03
< 0.002
Alloy Component
Melting Point, ℃
Tensile Strength, g/cm3
Rigidity HB
Heat Conductivity M.S.K
Tensile Strength, MPa
Elongation Rate, %
Electric Conductivity, %
Sn99Ag0.3Cu0.7
230
7.4
9
64
32
48
16.0
The Sn99Ag0.3Cu0.7 solder bar is ideal for use in the hi-tech wave soldering machines as well as the small-sized tin furnaces. Moreover, our product can be applied in the printed circuit board (PCB) and the stainless steel products.
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