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  • Tin Ingots
    Tin Ingots Brand £º  R-Tin                               Composition £º Sn 99.9 %   D i mension £º 420*105*100m m                  Origin £º Hebei,China  Standard £º GB/T 728-1998 P ackage :   It  is about 25Kg/Ingot, 40 Ingots/ Bundle, Bundle weight: 1000+/-30Kg Application :   It is suitable for the production of tinplate, tin-based bearing alloys, tin-lead solder, tin chemical products, etc. It is widely used in food packaging, electronics industry, and glass manufacturing industry. ...
  • Tin Paste/Solder Paste
    Tin Paste/Solder Paste Brand £º  R-Tin                                  Composition £º Sn42%   Bi58% Powder D iameter £º 2 5 ~45u m          Weight £º 5 00 g / Can Pakcage £º 1 0 KGS /Box                       Origin £º Hebei,China   ...
  • Lead Free Low Temperature Tin Wires/Solder Wires
    Lead Free Low Temperature Tin Wires/Solder Wires Brand£ºR-Tin Composition£ºSn42%Bi58% Diameter£º0.8~2.0mm Weight£º500g Working Temperature£º180 ¡æ Melt Point£º138¡æ Pakcage£º20Roll/Box Origin£ºHebei,China Application: It is suitable for low-temperature lead-free packaging of heat-sensitive components, manual soldering and automatic soldering in the field of secondary packaging of circuit boards; it is suitable for welding of heat-sensitive components. Product Description: The melting point of our Sn42Bi58 solid wire alloy is 138¡ãC, which can meet the welding and packaging requirements of electronic components that are sensitive to welding temperatures. We use our own patented technology to customize special equipment and molds to manufacture brittle tin-bismuth eutectic alloy tin wire. The low-temperature solder has a low melting point and the welding operating temperature is 190¡ãC. The brightness of lead-free low-temperature solder joints, welding mechanical strength, tensile toughness and electronic conductivity are greatly improved. The diameter of lead-free low-temperature tin wire is available from 0.6mm-2.0mm, and flux must b ...
  • Tin Balls/Solder Balls
    Tin Balls/Solder Balls Brand £º  R-Tin                               Composition £º Sn 99.98 %  Diameter £º 2 5 .0mm                     Weight £º about 58 g /ball Pakcage £º 15KGS /Box                       Origin £º Hebei,China    Application: Applicable to electroplating, circuit board production, electronics industry and other industries Product Description: The tin balls produced by our company are made of high-purity tin raw materials from Yunnan tin mines. They have uniform structure, fine grains, no defects, clean and pollution-free surfaces, can withstand high-density current operations, have uniform consumption, and produce less anode mud. ...
  • Lead Free Tin Anode Plates
    Lead Free Tin Anode Plates Brand £º  R-Tin                                        Composition  £º Sn  99.98 %   D i mension £º 5 00*300*100 m m              Origin £º Hebei,China    Application: Applicable to electroplating, circuit board production, electronics industry and other industries Product Description: The tin Plate s produced by our company are made of high-purity tin raw materials from Yunnan tin mines. They have uniform structure, fine grains, no defects, clean and pollution-free surfaces, can withstand high-density current operations, have uniform consumption, and produce less anode mud.   Product Characteristics :   It is widely used in electroplating, circuit board production, electronics industry and other industries. The product meets the requirements of Japanese industrial standard JIS Z3283-A and American industrial standard QQS 571E.   ...
Call:+86-173-3111-1968

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Bismuth Granules Bismuth Ingot Sn42/Bi58 Solder Bar Rich Tin/Sn Solder Bar Sn99Ag0.3Cu0.7 Solder Bar Sn99.93 Cu0.7 Solder Bar

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We have been working hard to constantly promote process improvement and technological innovation. And we always committed to provide high-quality products.

Tin Ingots

Tin Ingots

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Tin Paste/Solder Paste

Tin Paste/Solder Paste

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Lead Free Low Temperature Tin Wires/Solder Wires

Lead Free Low Temperature Tin Wi..

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Tin Balls/Solder Balls

Tin Balls/Solder Balls

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Lead Free Tin Anode Plates

Lead Free Tin Anode Plates

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Lead Free Tin Bar

Lead Free Tin Bar

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Bismuth Granules

Bismuth Granules

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Bismuth Ingot

Bismuth Ingot

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Sn42/Bi58 Solder Bar

Sn42/Bi58 Solder Bar

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Rich Tin/Sn Solder Bar

Rich Tin/Sn Solder Bar

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Sn99Ag0.3Cu0.7 Solder Bar

Sn99Ag0.3Cu0.7 Solder Bar

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Sn99.93 Cu0.7 Solder Bar

Sn99.93 Cu0.7 Solder Bar

Inquire Now
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Total:2 page, with 13 products

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