Brand：R-Tin	Composition：Sn42%Bi58%
Diameter：0.8~2.0mm	Weight：500g
Working Temperature：180 ℃	Melt Point：138℃
Pakcage：20Roll/Box	Origin：Hebei,China

Application:
It is suitable for low-temperature lead-free packaging of heat-sensitive components, manual soldering and automatic soldering in the field of secondary packaging of circuit boards; it is suitable for welding of heat-sensitive components.

Product Description:
The melting point of our Sn42Bi58 solid wire alloy is 138°C, which can meet the welding and packaging requirements of electronic components that are sensitive to welding temperatures.

We use our own patented technology to customize special equipment and molds to manufacture brittle tin-bismuth eutectic alloy tin wire. The low-temperature solder has a low melting point and the welding operating temperature is 190°C.

The brightness of lead-free low-temperature solder joints, welding mechanical strength, tensile toughness and electronic conductivity are greatly improved. The diameter of lead-free low-temperature tin wire is available from 0.6mm-2.0mm, and flux must be used during welding

Features:
The Sn42Bi58 lead-free low-temperature solder wire produced by our company not only has the characteristics of fast soldering speed and firm welding, but also has fine alloy structure, uniform composition and excellent welding performance. At the same time, the computer micro-controlled strong wire-taking machine is used to arrange the tin wire in an orderly manner.

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