1. How to Handle Incomplete Solder Joints and Pointed Tips After Welding with Solder Bars?
Answer: Incomplete solder joints are generally related to the purity of the solder material. To achieve ideal solder joints, besides using high-purity solder bars, it is necessary to use highly active flux as a complement. The pointed tip phenomenon mainly results from insufficient flux activity and low tin purity. The root solution is to use high-activity flux and Yongjiarun solder bars.

2. What to Do When Surface Residue, Dullness, or Blistering Occurs?
Answer: These issues are typically determined by manufacturing processes and molds. For example, insufficient surface scraping during production, poor cooling systems, or rough molds can cause the above problems. When handling solder bars, avoid direct contact with bare hands, as moisture from hands will affect their brightness. Blistering in solder bars is related to weather conditions during manufacturing. If stored for a long time or in a humid environment, the surface may form an oxide layer, darkening the brightness—but this is a normal phenomenon that does not affect usability.

3. How to Address Explosions and Blistering When Solder Bars Melt in a Tin Furnace?
Answer: This problem mainly depends on the purity of the solder bar material and whether all residues were thoroughly removed during the manufacturing process. Excessive residues in the tin furnace will generate bubbles after melting. When adding solder bars, ensure they are dry; when passing circuit boards through, pay attention to the rosin water, and prevent tin splash explosions when entering the tin furnace.

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